Blog – Latest Updates about the electronics industry, IPC and PIEK

Learn about what is going on in the electronics manufacturing industry, IPC news, new IPC releases, photos during training courses and industry events.

IEC New Release: IEC TR 61340-5-2 Electrostatics – Protection of electronic devices from electrostatic phenomena

IEC TR 61340-5-2:2018, which has been developed to support IEC 61340-5-1, applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V HBM, 200 V CDM and 35 V for isolated conductors. Additional control elements or adjusted limits can be applicable for ESDS with lower withstand voltages. This second edition of IEC TR 61340-5-2 has [...]

By | 2018-06-20T09:33:21+00:00 20 June 2018|PIEK News|

Employees used to be proud and loyal, but how about now?

Things used to be different back in the day. This is certainly true for one particular development: the time that employees stay with one and the same company. Employees used to start working for a company at a very early age and they would go up the ladder over the years, building the company as they went along. Pride in their work and loyalty until retirement to what they built themselves was very common. Binding employees to a [...]

By | 2018-06-13T12:11:45+00:00 13 June 2018|PIEK News|

IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies Number of pages 28. Released April 2018. Scope This Addendum provides requirements to be used in addition to, and [...]

By | 2018-06-20T09:38:51+00:00 23 May 2018|IPC New Release|

IPC New Release: IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

The IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics, textiles, stretchable polymers, etc.). IPC New Release: IPC-2292: Design Standard for Printed Electronics on Flexible Substrates IPC-2292 standard also defines three Standard Printed [...]

By | 2018-06-20T09:41:51+00:00 22 May 2018|IPC New Release|

IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal [...]

By | 2018-05-18T08:02:13+00:00 18 May 2018|IPC New Release|

Highlight at the 2018 SMT

PIEK and IPC would be delighted to welcome you at this year’s SMT Hybrid Packaging Fair in Nuremberg. Please visit our stand no. 400 in Hall 4 and find the experts in the electronic interconnect industry there. Exchanging experiences, getting to know each other and entering the hand-soldering competition are the main things to go for. Invitation to the IPC HSC for Professionals This competition reveals who is an expert in hand soldering. Only those who can hand [...]

By | 2018-05-17T12:15:29+00:00 17 May 2018|IPC News, PIEK News|

IPC New Release: IPC-4203B, Cover and Bonding Material for Flexible Printed Circuitry

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC New Release: IPC-4203B, Cover and Bonding Material for Flexible Printed Circuitry IPC-4203B does not cover non-flexible adhesives designed to be used in [...]

By | 2018-05-16T09:56:01+00:00 16 May 2018|IPC New Release|

Less should be more in the future

This article will focus on energy consumption. Though this is not a new theme, it is a major one impacting the electronics industry more and more and leading to ever greater challenges. Electronic devices are essential parts of our lives. In Germany alone 1.8 million tonnes of electronic equipment are sold every year. It is not so important that each of us regularly wants to have the latest mobile phone, but the latest model should always be better, [...]

By | 2018-05-08T08:59:16+00:00 8 May 2018|PIEK News|

Upheaval in the transport sector

Autonomously driving lorries with sensors on board, containers with sensors and cranes equipped with artificial intelligence can all communicate with each other. It sounds like science fiction, but it is no longer so. It is the beginning of dramatic changes in the transport sector. Professions such as a lorry driver, a taxi driver and a package deliveryman may not have a long life span anymore. Increasing automation in the transport sector and the services and industries linked to [...]

By | 2018-04-24T19:56:17+00:00 24 April 2018|PIEK News|

Concentration of industries in Europe

Various researchers have looked into the reasons why there is a concentration of industries in certain geographical areas and not in others. Their research nearly always indicates that there is a connection between the clustering of industries and the characteristics of geographical areas. There are three factors at play, namely the presence of goods, people and ideas. The extent to which the three factors are present somewhere determines whether clustering takes place there or not. These three factors [...]

By | 2018-04-18T10:05:29+00:00 18 April 2018|PIEK News|