Blog – Latest Updates about the electronics industry, IPC and PIEK

Learn about what is going on in the electronics manufacturing industry, IPC news, new IPC releases, photos during training courses and industry events.

Concentration of industries in Europe

Various researchers have looked into the reasons why there is a concentration of industries in certain geographical areas and not in others. Their research nearly always indicates that there is a connection between the clustering of industries and the characteristics of geographical areas. There are three factors at play, namely the presence of goods, people and ideas. The extent to which the three factors are present somewhere determines whether clustering takes place there or not. These three factors [...]

By | 2018-04-18T10:05:29+00:00 18 April 2018|PIEK News|

Smart trees make street lighting redundant

Imagine a world in which street lighting is superfluous. No extra energy would be needed to power street lamps, because trees and shrubs already light the streets. It could be a horror scenario for energy suppliers and for producers of street lamps and lighting equipment, since it would endanger their business model. For the European Union and its 20-20-20 objectives, however, the idea would be a dream come true. At the moment research is being done into bioluminescence [...]

By | 2018-04-03T11:02:24+00:00 3 April 2018|PIEK News|

4D printing is hot, 3D printing is not

Many people will not know this, but 3D printing has been around for 30 years. The technology is used with various every-day products, such as toys, household gadgets and technical tools. 3D printing technology is also used in the automotive industry, aviation and aerospace, the medical world and the building sector. Particularly in the medical world 3D printing technology has proved to be a quantum leap forward. This technology allows for instance burn victims to be treated better, [...]

By | 2018-03-20T11:40:34+00:00 20 March 2018|PIEK News|

Sensors, the new human eyes

Sensor technology is making rapid progress, opening up many options for innovations. The autonomously driving car is one of these, and in the maritime world sensor technology has also become a key technology. The technology used there for years is now trickling through in the automotive industry. A good example is the new LIDAR systems (Light Detection And Ranging or Laser Imaging Detection and Ranging). This technology can be compared with radar technology that has been used for [...]

By | 2018-03-15T08:16:05+00:00 15 March 2018|PIEK News|

IPC New Release: IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications

IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition of thermal conductivity of laminates and bonding material, IPC-4103B also [...]

By | 2018-03-09T08:02:36+00:00 9 March 2018|IPC New Release|

IPC New Release: EIA/IPC/JEDEC J-STD-002E – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. EIA/IPC/JEDEC J-STD-002E - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires IPC-J-STD-002E is intended for use by both supplier and user. The IPC-J-STD-002E standard was developed by the following three organizations: ECIA, IPC and JEDEC. [...]

By | 2018-03-08T13:38:05+00:00 8 March 2018|IPC New Release|

IPC New Release: IPC-6903A Terms and Definitions for the Design and Manufacture of Printed Electronics

IPC-6903A provides 62 additional terms and definitions for the design and manufacture of printed electronics. IPC-6903A Terms and Definitions for the Design and Manufacture of Printed Electronics The standard creates a common language and understanding for the worldwide printed electronics community. 1 SCOPE This standard provides industry-approved terms and definitions for the design and manufacture of printed electronics. 1.1 Purpose The purpose of this standard is to provide the electronics industry with terms and definitions for specifying, designing [...]

By | 2018-03-08T13:27:32+00:00 8 March 2018|IPC New Release|

One-stop shopping

It is becoming much more common in the retail business, having just the one place to which you can turn for all your shopping. Marketeers call this phenomenon one-stop shopping. In the technical interconnect industry there is also one organisation to which this concept applies. It is PIEK. The family-run business PIEK is a household name in the technical interconnect industry. And this has its reasons. PIEK stands for one-stop shopping. It is the only provider in Europe [...]

By | 2018-03-08T13:24:04+00:00 8 March 2018|PIEK News|

IPC New Release: IPC-7094A, Design and Assembly Process Implementation for Flip Chip and Die-Size Components

IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. IPC-7094A, Design and Assembly Process Implementation for Flip Chip and Die-Size Components The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and reliability issues associated with flip chip and die-size package technologies, including [...]

By | 2018-03-08T11:06:18+00:00 8 March 2018|IPC New Release|