List with new releases from IPC.
IPC New Release: IPC-7094A, Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. IPC-7094A, Design and Assembly Process Implementation for Flip Chip and Die-Size Components The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and reliability issues associated with flip chip and die-size package technologies, including [...]