IEC New Release: IEC TR 61340-5-2 Electrostatics – Protection of electronic devices from electrostatic phenomena

IEC TR 61340-5-2:2018, which has been developed to support IEC 61340-5-1, applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V HBM, 200 V CDM and 35 V for isolated conductors. Additional control elements or adjusted limits can be applicable for ESDS with lower withstand voltages. This second edition of IEC TR 61340-5-2 has been modified to provide guidance for users of IEC 61340-5-1:2016. The text has been arranged to follow the requirements of IEC 61340‑5‑1:2016 as closely as possible as well as providing specific guidance on each of the requirements of IEC 61340-5-1:2016.

IEC New Release: IEC TR 61340-5-2 Electrostatics – Protection of electronic devices from electrostatic phenomena

This user guide has been produced for individuals and organizations that are faced with controlling electrostatic discharge (ESD). It provides guidance that can be used for developing, implementing and monitoring an electrostatic discharge control program in accordance with IEC 61340-5-1.

Avoid a discharge from any charged, conductive object (personnel, equipment) into the sensitive device: It is preferred that all conductors that may come into contact with ESDS including personnel, are bonded or electrically connected to a known ground or contrived ground (as on shipboard or on aircraft). This attachment creates an equipotential balance between all items and personnel. Electrostatic protection can be maintained at a potential different from “zero” voltage ground potential, as long as all items in the system are at the same potential. If a conductor that cannot be grounded (e.g. isolated conductor) comes into contact with an ESDS, the ESD risk should be evaluated and if necessary mitigated.

Preview the IEC TR 61340-5-2 .pdf file.

More info: https://webstore.iec.ch/publication/28047

By |2018-06-20T09:33:21+00:0020 June 2018|PIEK News|