IPC New Release: IPC-7095D, Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7095D describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.

IPC-7095D, Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7095D provides useful and practical information to those who use or are considering using BGAs. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

Number of pages 208. Released July 2018.

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using
these packages.
1.1 Purpose The purpose of this standard is to provide useful and practical information to those who use or are considering using BGAs. The target audiences for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies.
1.1.1 Intent This document describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly. For accept/reject criteria and requirements for BGA assemblies, see J-STD-001 and IPC-A-610

Preview the IPC-7095D table of contents .pdf file.

By |2018-07-30T09:57:18+00:0030 July 2018|IPC New Release|