IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components.

IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

Number of pages 32. Released April 2018.

The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflw and process sensitive devices that have been classifid to the levels defied in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflw temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflw can be achieved. The dry-packing process defied herein provides a minimum shelf life of 12 months from the seal date.
1.2 Scope This standard applies to all devices subjected to bulk solder reflw processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.

Preview the IPC/JEDEC J-STD-033D table of contents .pdf file.

By |2018-05-18T08:02:13+00:0018 May 2018|IPC New Release|